This is content that excites and engages motivated private investors. We are experts in medium and small-cap markets, we also keep our community up to date with blue-chip companies, commodities and broader investment stories. Proactive news team spans the world’s key finance and investing hubs with bureaus and studios in London, New York, Toronto, Vancouver, Sydney and Perth. All our content is produced independently by our experienced and qualified teams of news journalists. Proactive financial news and online broadcast teams provide fast, accessible, informative and actionable business and finance news content to a global investment audience. Prior to joining Proactive in 2016, he was News Editor for .uk. After over 10 years, which saw him rise to be Markets Editor at AFX, the firm’s acquisition by Thomson Corp and subsequent takeover of Reuters, he moved on in 2012. He helped set up MarketEye News for ICV/Topic in the 1990’s before moving on to become a Markets reporter at S&P MarketScope and then AFX News. A mean time to failure relationship of lead-free solder joints under pulsed current loading is proposed based on the experimental data.Jon has been reporting on stock markets for almost thirty years for newspapers, newswires, and websites. SEM image shows that damage develops at both current crowding corners and the skin layer of solder joints. Higher frequency leads to a shorter lifetime within the frequency range we studied. It was observed that Mean Time to Failure (MTTF) was inversely proportional to the current density and duty factor. The nominal current density varied from 1.0 × 10 5 A/cm 2 to 2.1 × 10 5 A/cm 2, PDC frequency ranged from 2 MHz to 10 MHz, and duty factor varied between 30% and 80% with a controlled ambient temperature at 70 ° C. During the test, frequency, current density and duty factors are used as controlling parameters. In this study, high frequency pulse current electromigration degradation experiments were carried out on Sn96.5%Ag3.0%Cu0.5 (SAC305-by weight) solder joints. As a consequence, immense information processing duties, high current density and large joule heating are exerted on the package, which makes electromigration and thermomigration a serious reliability issue. The insatiable demand for miniaturization of consumer electronics has brought continuing challenges in the electronic packaging field. In this work, we presented both the wafer level and package EM testing methodologies, and the rigorous data analysis that takes into account of the bimodal distribution of EM test data. Rigorous statistical analysis of EM test data is another key factor for this accurate assessment. The understanding of EM has also led to a better EM testing methodology in order to accurately assess the EM of an interconnection. This identification leads to various design and process modifications and inventions in order to face the challenges of high EM reliability for an ever shrinking interconnection. The extensive studies of EM lead to a much better understanding of the physics of EM, and with this understanding, the factors that affect the EM of interconnects, especially at the field operating conditions are identified and presented here. Both approaches are presented in this work. As a result, the conventional diffusion path approach for the modeling of EM is inadequate, and the driving force approach is needed. However, as the interconnect line width shrinks to submicrometer level, other driving forces become important and even dominating. Electron wind force was proposed to be the driving force for EM. In this work, the history and the evolution on the studies of EM are presented for both Al and Cu interconnection. The first reported work on electromigration (EM) was presented in 1959, and since then extensive studies on the EM are being conducted theoretically, experimentally and numerically.
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